Showing results: 601 - 607 of 607 items found.
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Model 5953 -
Pentek, Inc.
- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional VITA-66.4 optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA-46, VITA-48, VITA-66.4, VITA-57.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products- Model 4801 Carrier Design Kit for designing custom carrier for the Model 6003 QuartzXM- Model 6003 unique QuartzXM eXpress module enables migration to other form factorsPentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products VideoLive Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boardsPipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoCSynchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPXPlease refer to the product datasheet for Installed FPGA IP Module details
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Model 54891 -
Pentek, Inc.
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Accepts RF signals from 925 MHz to 2175 MHz- Programmable LNA handles L-Band input signal levels from -50 dBm to + 10 dBm- Programmable analog downconverter provides IF or I+Q baseband signals at frequencies up to 123 MHz- Two 400 MHz 12-bit A/Ds digitize IF or I+Q signals synchronously- Two FPGA-based multiband DDCs (digital downconverters)- Xilinx® Kintex® UltraScale™ FPGA- Five GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- PCI Express interface (Gen. 1, 2 & 3) up to x8- Clock/sync bus for multimodule synchronization- Optional LVDS and gigabit serial connections for FPGA for custom I/O- Optional optical interface for data streaming- Navigator BSP® for software development- Navigator FDK® for custom IP development- Spark® fully-integrated development system- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Model 58891 -
Pentek, Inc.
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Accepts RF signals from 925 MHz to 2175 MHz- Programmable LNA handles L-Band input signal levels from -50 dBm to + 10 dBm- Programmable analog downconverter provides IF or I+Q baseband signals at frequencies up to 123 MHz- Four 400 MHz 12-bit A/Ds digitize IF or I+Q signals synchronously- Four FPGA-based multiband DDCs (digital downconverters)- Two Xilinx® Kintex® UltraScale™ FPGA- 10 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- PCI Express interface (Gen. 1, 2 & 3) up to x8- Clock/sync bus for multimodule synchronization- Optional LVDS and gigabit serial connections for FPGA for custom I/O- Navigator BSP® for software development- Navigator FDK® for custom IP development- Spark® fully-integrated development system- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Model 5950 -
Pentek, Inc.
- Now available in RFSoC Gen 3 with the Model 5953- Multi-board synchronization with Quartz RFSoC video- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional VITA-66.4 optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA-46, VITA-48, VITA-66.4, VITA-57.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products- Model 4801 Carrier Design Kit for designing custom carrier for the Model 6001 QuartzXM- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX
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MIC-6313 -
Advantech Co. Ltd.
The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
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MIC-6311 -
Advantech Co. Ltd.
Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
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NA362 -
Axiomtek Co., Ltd.
The NA362 is powered by the low power consumption Intel® Atom™ processor C3338/C3558/C3758 (Codename: Denverton). In addition to six 10/100/1000 Mbps LAN ports (Intel® i210 Ethernet controller), this desktop network appliance also comes with four 10 GbE SFP+ fiber ports for high bandwidth and long-distance communications. The NA362 is an excellent choice for a wide array of network applications including UTM, VPN, firewall, gateway, SD-WAN and vCPE with its enhanced security and performance. The Denverton–based NA362 features the Intel® QuickAssist Technology (Intel® QAT) for accelerated data processing including symmetric encryption and authentication, asymmetric encryption, digital signatures, RSA, DH, ECC, and lossless data compression. Furthermore, it also supports the Intel® Data Plane Development Kit (Intel® DPDK), which greatly boosts packet processing performance and throughput, allowing more time for data plane applications. The NA362 comes with either two or four DDR4 R-DIMM/U-DIMM with 64GB or 128GB of non-buffer non-ECC/ECC memory. The slim-type network communication platform is equipped with one 2.5" SATA3 HDD and one mSATA for sufficient storage. It also supports wireless communication of Wi-Fi, 3G, LTE through a PCI Express Mini Card slot. I/O options include two USB 2.0 ports and a serial console port. To ensure reliable operation, the 10-port network platform supports watchdog timer. Moreover, it also supports mainstream Yocto, Linux, Windows® Server 2012 R2, and Windows® Server 2016 operating systems.
